Active Projects EDA Learn: Machine Learning for Electronic Design Automation A graph-based machine learning program that predicts expensive late-stage chip metrics from early design stages, and the open data infrastructure built to make those models reproducible and reusable across the community. Power Reduction using NTC with CML Our primary objective is to design circuits with minimum power consumption and higher energy efficiency. We implement NTC to minimize the power of the circuits. However, using purely near-threshold de... Attack Prevention Through Design for Trust Algorithms and Methodologies EDA tools used for circuit design implement algorithms and methodologies that account for the power, area, and performance of the many blocks comprising the IC. With the more recent threat of untruste... Run-time Detection and Countermeasures Current work exploring hardware Trojan detection is concentrated around post fabrication testing of an IC. Test vectors are implemented to "activate" hardware Trojans during the post fabrication test ... On-Chip Power Delivery with Run-Time Voltage Regulator Clustering With the paradigm shift in computing systems from performance oriented design to energy efficiency, there is considerable research effort to optimize the core configuration by reducing the over-provis... Clock Tree Synthesis (CTS) for 3-D Integrated Circuits Recent work has explored CTS for 3-D ICs by extending algorithms devised for 2D ICs such as the Methods of Means and Medians (MMM), Nearest Neighbor Graph (NNG) and Deferred Merging Algorithm (DME) fo... Completed Projects Thermal Modeling and Mitigation Two of the most omnipresent and challenging issues in high performance 3-D systems are power delivery and thermal management. The interdependence of these issues is of critical importance to 3-D syste... 3-D Integrated Free-Space Optical Interconnect for Multi-Core Systems State of the art microprocessors and SoCs experience a degradation in the performance and signal integrity of on-chip metal interconnects with each successive technology generation due to increased re... 3-D Integrated Circuit Power Delivery An important issue for 3-D integrated circuits is the design of a robust power distribution network that can provide sufficient current to every load within a system. Power delivery in 3-D integrated ... Synchronization in 3-D Integrated Circuits Synchronization amongst various sequential elements of a two-dimensional IC is a challenge which is further exacerbated when considering a three-dimensional IC. Our work focused on multi-plane synchro... TSV Modeling and Characterization The critical component of a 3-D IC is the through-silicon via. Our seminal work on the electrical characterization of the TSV resistance, capacitance, and inductance as a function of the diameter, len...
